MYR 3,000.00 - 5,000.00 per month
George Town, Penang, Malaysia
Male
18 years old and above
Date Posted: Feb 26, 2025
Last Job Ad Activity: Feb 26, 2025
Apply Until: Mar 27, 2025
This job has already expired. These job details are for viewing purposes only.
Job Description
- 1. Responsible for Die Prep/ Die Attach process and equipment as demonstrated by the yield, quality, reliability performance of all customer products.
- 2. Drive equipment capability, upgrading/modernization, sustainability, equipment efficiency & stability
- 3. Knowledge and exposure in wafer back grind, dicing, AOI, die attach, hands-on in Disco/ Okamoto/ASM/ ESEC equipment and troubleshooting is a must.
- 4. Drive, establish and implement process simplification/optimization programs/ process &equipment automation projects to improve yield, quality, lead time & cost
- 5. Drive cost saving projects through improve & qualify new cost-effective factory supplies and indirect material, factory supplies usage/wastage of reduction to meet Finance cost/sale target.
- 6. Manage of spare parts for equipment and repair of damage parts. 7. In charge of customer accounts to provide solution on technical difficulties/new technologies challenges, business review, calibrate new products & technology roadmap.
- 8. Lead in knowledge GURU programs, to up-skill workforce productivity & agility.
Job Qualifications
- A minimum of 5 year(s) of working experience is required.
- Candidates must be a Bachelor's / College Degree holder in Engineering(Electrical/Electronic) or similar fields.
- Male applicants are preferred for this role.
- Must possess strong knowledge in Die-Attach process involving multi-die stack technology (up to 16 die-stack) in memory product manufacturing.
- Practical experiences with all the equipment’s in die prep process and maintenance. Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, preventive maintenance.
Additional Information
- Experience in Semiconductor industry is an advantage
- ASE Malaysia Products: Lead Frame Packaging, Wire Bond BGA, Flip Chip Packaging, Power DFN/QFN with Cu Clip, Memory Packaging & WLCSP (backend)
Principal / Employer
ASE ELECTRONICS (M) SDN BHD
DMW (formerly POEA) Registration / Accreditation No.
10413737101525
Principal / Employer Address
Free Industrial Zone, Bayan Lepas, Phase 4 Pulau, Penang, Malaysia
Placement Fee
This job has no placement fee.
Agency Details
Units 1102, 1103 & 1109 One Executive Bldg. No. 5 West Ave., Quezon City, Metro Manila, Philippines
POEA-090-LB-082622-R
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